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Conductive Paste
Silver Coated Copper Powder
Silver Coated Copper Powder is developed and produced by JBC Co.Ltd.(Korea)
- Property
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Narrow particle size range
Perfect coating
Good dispersability
Anti-oxidation
- Application
- Apply to silver pastes (Inks), EMI formulation (pastes), thick film circuit pastes, conductive adhesives, etc.
- Package
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PE bottle of 2kg/20kg net weight.
Stainless steel drum of 50kg/100kg net weight.
- Specification
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Item Particle size distribution (μm ) Tap Density
(g/cm3)Surface Area
(m2/g)Silver
(wt%)Shape Ave. Size D10 D50 D90 S-1703 3 0.5-2.5 2.9-3.5 4.0-5.5 4.5min. 0.4-0.6 17.0±1.0 Spherical S-1204 4 2.0-3.0 3.7-4.3 4.5-6.0 4.5-5.0 0.3-0.5 12.0±1.0 Spherical F-1508 8 2.5-4.0 7.0-8.5 15-20 3.0-4.0 0.5-0.7 15.0±1.0 Flake - SEM
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S-1703(2000×)
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S-1204(2000×)
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F-1508(2000×)
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